OEM & Custom POS Hardware, Coordinated in China

Tesp helps POS software teams and system integrators coordinate practical OEM hardware requirements with Chinese suppliers, including logo placement, packaging, boot logo, pre-loaded OS options, port layout checks, and sample verification before batch production.

Tesp does not manufacture hardware or provide custom R&D services. We help translate your practical OEM requirements into factory-side instructions, follow up with suppliers, and check approved samples or batch details where practical.

White-Labeling & Customization Capabilities

Brand Identity Integration

Silk-screen logos, custom enclosure colors, label placement, and packaging artwork can be coordinated with the supplier. Tesp checks logo position, print clarity, and visible sample details where practical.

I/O & Peripheral Modifications

If your project needs specific legacy I/O ports, built-in peripherals, scanner modules, printer options, or payment terminal brackets, Tesp checks the factory’s available configurations and confirms practical fit before order approval.

Firmware & OS Pre-loading

Tesp can coordinate supplier-side pre-loading requests such as Android image, Windows setup, boot logo, language option, or basic configuration requirements. Final feasibility depends on supplier firmware and MOQ policy.

How Tesp Reduces OEM Execution Risk

Requirement Translation

Tesp converts your branding, label, packaging, and configuration requirements into clear supplier-side instructions, reducing avoidable misunderstanding around logo placement, shipping marks, and hardware options.

Sample Verification

Before batch production, Tesp can check the approved sample or supplier-provided proof against your requirements, including boot logo display, printed logo position, label content, and visible enclosure details.

Batch Consistency Checks

Where practical, Tesp can review random batch units or packaging samples for visible consistency, label placement, carton markings, and accessory completeness before shipment.

OEM Modification Baselines

Modification Type	Typical ISV Request	Tesp Checkpoint
Visual Branding	Silk-screen logo, custom bezel color, label placement, or branded enclosure details.	Logo Position Review Print Clarity Check Color Sample Review
Software / Boot	Custom Android boot logo, Windows setup, BIOS logo, language setting, or pre-loaded app request.	Cold-Boot Video Display Fit Review Sample Confirmation
Interface I/O	Legacy COM ports, hidden USB ports, scanner module, payment bracket, or specific peripheral layout.	Port Layout Check Physical Fit Review Supplier Feasibility
Packaging	Branded carton boxes, custom quick-start guides, serial labels, shipping marks, or accessory packaging.	Artwork Comparison Carton Mark Review Accessory Check

Frequent OEM Questions from Software Teams

Q1: What is the MOQ for adding our logo?

MOQ depends on the supplier, product type, logo method, color requirement, packaging scope, and production schedule. Some factories can support lower-MOQ pilot branding, while deeper customization may require higher quantities. Tesp can check practical options with suppliers before you commit.

Q2: We need to change the motherboard configuration. Can you handle this?

Tesp can coordinate supplier communication for available hardware configuration options, such as I/O layout, boot logo, storage, RAM, or standard peripheral modules. Custom motherboard redesign or deep R&D work is outside Tesp’s service scope unless a supplier separately confirms it.

Q3: Do you provide physical color matching inspection for custom enclosures?

Where practical, Tesp can compare the supplier’s actual plastic or paint sample against your provided color reference or spec sheet under factory lighting. This is a practical visual review, not a certified color lab inspection.

Q4: How do you verify that our regulatory labels and shipping marks are correct?

Tesp can compare your approved PDF artwork or label file with actual printed shipping marks, product labels, serial number stickers, and carton markings before shipment. This helps reduce avoidable spelling, layout, and documentation mismatches.

Review Your OEM Hardware Requirements

Tell us your branding, packaging, boot logo, port layout, OS setup, target quantity, and deployment region. Tesp will review your requirements and check practical supplier options in China.